6092/SiC/44p and 6063/SiC/50p - High Stability Requirements
• 6092/SiC/44p
• Enhanced YS & UTS high stiffness and low CTE
• Beryllium replacement and electronic packaging
• 6063/SiC/50p
• Low CTE & high thermal conductivity, high stiffness
• Thermal management and electronic packaging
• Supplied as billets for machined parts
• Suitable for simple forging
MMCs vs. Conventional Materials
Additional data and manufacturing information available upon request
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